CURABLE HEAT-SEAL ADHESIVES FOR BONDING POLYMERS

Curable compositions include a urethane (meth)acrylate oligomer having a number- average molecular weight of at least 6000 g/mol; at least one mono(meth)acrylate monomer; a multifunctional crosslinking monomer chosen from acrylate monomers， methacrylate monomers， or combinations thereof; and an ethylene–vinyl acetate grafted terpolymer. The mono(meth)acrylate monomers may include a first mono(meth)acrylate with Tg between 50 °C and 175 °C and a second mono(meth)acrylate with Tg between ??50 °C and 30 °C. The curable compositions may be applied onto a surface of a substrate then cured to form a low-tack adhesive layer on the surface. The curable compositions may be cured by exposure to visible radiation， UV radiation， LED radiation， laser radiation， electron-beam radiation， peroxide， accelerator， or heat. Methods for bonding substrates include contacting a second substrate to a low-tack adhesive layer on a first substrate， then heating the low-tack adhesive layer to bond the substrates and form a laminate.