Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm
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https://data.mendeley.com/datasets/9n5z75smz3
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资源简介：
Data accompanied with the paper 'Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm'.
Figure 1 is the original C-scan SAM image of the FA10 flip chip sample. Table 1 shows the numerical values of the features.
创建时间：
2016-10-07
