56el4YES8M1YM0HSB63Pa/OpenInterconnect

OpenInterconnect是一个用于机器学习代理建模的开放数据集和基准，专注于die-to-die互连S参数。该数据集包含两种硅中介层式互连结构的全波电磁仿真结果：微带/uSTRIP和共面波导（CPW）。每个示例将几何特征和频率与复杂的S参数目标配对，目标以实部和虚部提供，并包含归一化和原始列（如适用）。基准预测四个S参数项：S11（回波损耗）、S12（插入损耗）、S13（近端串扰）和S14（远端串扰）。数据集文件以Parquet格式存储，分为训练、验证和测试集，并附带元数据JSON文件。OpenInterconnect is an open dataset and benchmark for machine-learning surrogate modeling of die-to-die interconnect S-parameters. The dataset contains full-wave electromagnetic simulation results for two families of silicon-interposer-style interconnect structures: microstrip/uSTRIP and coplanar waveguide (CPW). Each example pairs geometric features and frequency with a complex S-parameter target. Targets are provided as real and imaginary components, with normalized and raw columns included where applicable. The benchmark predicts four S-parameter terms: S11 (return loss), S12 (insertion loss), S13 (near-end crosstalk), and S14 (far-end crosstalk). The dataset files are stored in Parquet format, split into train, validation, and test sets, and accompanied by metadata JSON files.