Dataset to the publication Functional grading of low alloy steel to 316 L by wire arc additive manufacturing – Microstructural and mechanical characterization of bi-metal interface

Dataset to the publication Functional grading of low alloy steel to 316 L by wire arc additive manufacturing – Microstructural and mechanical characterization of bi-metal interface. The data was obtained to describe the microstructural constituents formed at the diluted interface layer formed between low alloy and stainless steels after cladding one onto the other during multi-material additive manufacturing. The data is the one measured through metallurgical and mechanical characterization procedures. Data set includes the output of several techniques, including: Digital Image Correlation data (DIC) - measurement snapshots of engineering stress, correlated to lead levels measuredElectron Backscatter Diffraction (EBSD) - crystallographic information files, including files and graphs shown in the related publicationElectron Probe Microanalysis (EPMA) - Elemental quantification measurements, in wt%, as well Stacking Fault Energy and Martensite Start Temperature values derived from empirical relationships therefrom.Hardness Measurements - including geometrical and spatial data on every indentation madeScanning Transmission Electron Microscopy (STEM) micrographs and Electron Dispersive Spectroscpy (EDS) measurements therefromThermoCalc simulation results, including Scheil calculations as well as CCT figures for undiluted parent alloys and different degrees of dilution onto one another.

本数据集对应题为《丝材电弧增材制造制备低合金钢至316L不锈钢功能梯度结构——双金属界面微观组织与力学性能表征》的学术论文。本数据集所收录的数据，旨在描述多材料增材制造过程中，低合金钢与不锈钢通过逐层熔覆复合后形成的稀释界面层内的微观组织组成。所有数据均通过冶金学与力学性能表征流程测得。本数据集包含多种表征技术的实测输出结果，具体包括：数字图像相关（Digital Image Correlation, DIC）数据：工程应力的测量快照，与实测的铅含量相关联；电子背散射衍射（Electron Backscatter Diffraction, EBSD）数据：晶体学信息文件，包含相关学术论文中展示的各类文件与图谱；电子探针显微分析（Electron Probe Microanalysis, EPMA）数据：以质量分数（wt%）为单位的元素定量测量结果，以及由此通过经验关系式推导得到的层错能与马氏体转变开始温度数值；硬度测量数据：包含所有压痕的几何与空间分布信息；扫描透射电子显微镜（Scanning Transmission Electron Microscopy, STEM）显微图像，以及由此获得的电子能谱（Electron Dispersive Spectroscopy, EDS）测量结果；ThermoCalc模拟结果：包含未稀释母材合金的Scheil凝固计算，以及不同稀释程度下的连续冷却转变（Continuous Cooling Transformation, CCT）图谱。