Surface Analytic Data of Multiple Oxide-Nitride Dielectrics for 3D NAND Memory Fabrication

3D-NAND flash memory is currently essential in the semiconductor industry due to the interference issue between memory cells of the conventional planar type. To vertically stack the memory, an oxide-nitride (ON) stack structure is formed using plasma enhanced chemical vapor deposition (PECVD) equipment. Thereafter, a part of the silicon nitride (Si3N4) layer is removed by wet etching using phosphoric acid (H3PO4) to make a space for the memory cell. It is important to selectively wet etch only the Si3N4 film while protecting the silicon oxide (SiO2). In this dataset, Fourier Transformed-Infrared (FT-IR), X-ray reflectometry (XRR), and transelectron microscope (TEM) images are shared from the experiment to invesigate the process parameters that affect the etch rate in PECVD.