Data underlying the PhD dissertation 'Prognostics and Thermal Management of Power Electronic Packages'

The reliability of power electronic packages is often compromised by degradation mechanisms such as thermal fatigue and delamination, leading to economic consequences due to premature failures. Conventional approaches for reliability testing are inadequate for early fault detection. This research aims to develop a framework of prognostics based on online monitoring strategies for power electronic packages, with a particular focus on the die-attach interface material. The dataset provided in Chapters 2 and 3 is the lifetime reliability data of packages with different die-attach materials. The dataset provided in Chapter 5 is the thermal characterization data of different materials. The dataset provided in Chapter 7 is the device performance data with different thermal management strategies. To understand the data collection method and other calibration parameters, kindly refer to the dissertation document.

功率电子封装（power electronic packages）的可靠性常因热疲劳、分层等退化机制受损，过早失效将引发相应经济损失。传统可靠性测试方法难以实现早期故障检测。本研究旨在构建基于在线监测策略的功率电子封装寿命预测（prognostics）框架，重点聚焦于芯片粘接界面（die-attach interface）材料。第2章与第3章提供的数据集为采用不同芯片粘接材料的封装的寿命可靠性数据；第5章提供的数据集为不同材料的热特性表征数据；第7章提供的数据集为采用不同热管理策略时的器件性能数据。若需了解数据采集方法及其他校准参数，请参阅本学位论文文档。