Open-Source Silicon Die Area (OSSDA)

CONTEXT The Open-Source Silicon Die Area (OSSDA) dataset contains the characteristics of integrated circuits (ICs) and their corresponding silicon die areas. It serves as the main data source for the paper titled "Advancing Silicon Die Area Estimation for Integrated Circuit Modelling in Life-Cycle Assessments." The dataset was analyzed by the co-authors listed in this repository. The co-authors of this repository thank the members of the Fraunhofer IZM Institute for their contribution to the dataset, which enabled the models to be trained on a larger volume of data. USEFUL LINKS The corresponding regression models to predict the die area of ICs are downloadable via the following GitHub repository: https://github.com/anncollin/DieAreaRegressor A simplified user interface for these regression models is provided at: https://anncollin.github.io/DieAreaPrediction/ The paper can be found here: TBD LICENCES The portion of the dataset belonging to Fraunhofer "OSSDA_021726_FRAUNHOFER_IZM.xlsx" is licensed under Creative Commons Attribution Non-Commercial Share Alike 4.0 International (CC BY-NC-SA). The portion of the dataset belonging to UCLouvain "OSSDA_021726_UCLOUVAIN.xlsx" is licensed under Creative Commons Attribution 4.0 International (CC-BY). DATASET STRUCTURE The dataset is divided into two parts: the UCLouvain part and the Fraunhofer part. The UCLouvain part contains data for the training set and the test set. The Fraunhofer part was used only in the train set. OSSDA_021726_UCLOUVAIN.xlsx licence OSSDA_train Rows: 283 Columns: 24 Description: part 1 of the training set OSSDA_test Rows: 150 Columns: 32 Description: test set OSSDA_021726_FRAUNHOFER_IZM.xlsx licence OSSDA_train Rows: 208 Columns: 24 Description: part 2 of the training set