Tin whisker morphology of COTS device after thermal test

COTS device pins are typically coated with pure tin, which is susceptible to tin whisker growth, posing a reliability risk. This dataset summarizes the tin whisker morphology of several COTS devices after thermal testing, including thermal cycling and thermal vacuum testing. Morover, these devices are conducted different treatments including baking and overcoating. The results show that the tin whiskers still grow after baking at 75℃ for 72h, 168h and 336h. On the other hand, the effect of conformal coating on inhibiting tin whiskers growth was obvious, and no growth of tin whiskers was observed after 200 weeks for paralene.