Constructing Tanghulu-like Diamond@Silicon carbide nanowires for enhanced thermal conductivity of polymer composite

Polymer composites with high thermal conductivity possess light weight, easy process and high chemicalresistance, which has a huge demand in electronic packaging fields. Therefore, the development of new filler forimproving the thermal conductivity has attracted lots of attentions in the field of polymer composites. In thiswork, a new hybrid filler was prepared through depositing nano-crystalline diamonds on SiC nanowires by hotfilaments chemical vapor deposition. The results of SEM and TEM characterizations showed that the filler has anovel structure which is similar as a string of “sugar-coated haws on a stick” (a kind of Chinese candied fruit,named Tanghulu). Polymer composites containing the filler with the Tanghulu-like structure presented the highthermal conductivity of 0.57 W m−1 K−1 under 25 wt% filler contents. The excellent thermal conduction per­formance is attributed to the regional continuous networks formed by filler with the Tanghulu-like structure.
Infrared images and a cooling radiator were utilized to further confirm the high thermal transportation per­
formance of the polymer composites. The development of Tanghulu-like diamond@silicon carbide nanowires
proposes a new strategy to prepare polymer composites with enhanced thermal conductivity, which will further
promote the application in electronic packaging fields.