Structure and Properties of Pb-Sn and Pb-free Sn-Ag-Cu Solders Produced in Terrestrial vs. Microgravity Environments under Extremes of Elevated and Cryo Temperatures
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https://psi.nasa.gov/physci/repo/data/investigations/PSI-181
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资源简介：
This study addresses the reliability of solder joints in space by pursuing two principal objectives: (1) Characterization of solder-joint formation under microgravity conditions aboard the International Space Station, specifically examining the impact of suppressed convective flow and buoyancy on 40Pb-60Sn alloys utilized in the In-Space Soldering Investigation (ISSI). (2) Evaluation of the solder’s material and mechanical properties under extreme thermal environments, including elevated and cryogenic temperature exposures characteristic of spaceflight conditions.
提供机构：
NASA PSI
创建时间：
2025-04-17
