Silicon-based MEMS hybrid packaging approachfor terahertz front-end integration: architecture, design, and prototype validation

The rapid evolution of sixth-generation (6G) wireless communication is driving the development of compact, low-loss, and highly integrated front-end modules operating in the terahertz frequency range. However, conventional substrate-based (printed-circuit) and metallic waveguide-based solutions face inherent trade-offs among structural compactness, radiation efficiency, and chip-integration complexity at such high frequencies. To overcome these limitations, this paper proposes a silicon-based MEMS (micro-electro-mechanical systems) hybrid packaging approach, which combines the advantages of substrate- and waveguide-based solutions, featuring compact structure, high radiation efficiency, and flexible chip integration. The proposed approach is implemented on multilayer silicon wafers, integrating a waveguide slot array antenna, ground-signal-ground (GSG)-waveguide transversal transition, RF interconnection, and active chips within a unified MEMS framework.The waveguide antenna is co-designed with the GSG-waveguide transition, exhibiting a profile of 0.75 mm and achieving a peak gain of 25.3 dBi at 151 GHz with a radiation efficiency of 83.2%.A proof-of-concept prototype operating in D-band (110–170 GHz) is developed and characterized, validating effective front-end integration. This hybrid packaging approach establishes a scalable foundation for future 6G terahertz front-end systems, enabling compact, low-loss, and highly integrated implementations.