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2.SVRN_K0 Hybrid Cavity Full Hardware Specification and Experimental Verification

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Zenodo2026-02-19 更新2026-05-26 收录
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Zenodo Submission: SVRN_K0 Hardware Specification — Paper II 1. Title Complete Hardware Specification of SVRN_K0: A Hybrid Polariton Cavity for Room-Temperature Coherence 2. Identifiers Field Value Series DOI 10.5281/zenodo.18325543 Reference DOI (Paper 0) 10.5281/zenodo.18688294 Reference DOI (Paper I) 10.5281/zenodo.18687866 Reference DOI (Paper II) 10.5281/zenodo.18689820 Patent KR 10-2026-0017941 SHA-256 77fdffaa268ff4695096708aff09626e61463a242a9c681d167b5cb4707ff397 3. Abstract This work presents the complete hardware specification of SVRN_K0, a hybrid polariton cavity designed to achieve room-temperature (300 K) coherence time τ_coh ≥ 1.5 ns. Building on Paper I (quantum bankruptcy of copper interconnects) and Paper 0 (Bottleneck Intelligence as a physical law), this document provides the full GDS layer stack, BIC metasurface parameters, three active layer options, phononic shield design, DAC integration protocol, and experimental verification criteria. Four loss-suppression mechanisms are specified in hardware terms: BIC optical confinement — GDS Layer 1, Si₃N₄ nanohole array (Λ = 420 nm, r/Λ = 0.28, t = 220 nm), targeting Q_rad ≥ 10⁸ (†FDTD design target) 80-pair DBR reflectors — Ta₂O₅/SiO₂ quarter-wave stack, R ≥ 99.999% (†FDTD design target) High-pressure DAC integration — 20–30 GPa lattice contraction via diamond anvil cell, reducing deformation potential by 38–47% 18-pair Ru/Graphene phononic shielding — Ru(2 nm)/Graphene(5 layers) acoustic impedance mismatch structure targeting 50% γ_deph suppression (2.4×10⁸ s⁻¹ → 1.2×10⁸ s⁻¹) Three active layer options are specified with full GDS stack parameters: GaN/AlGaN, WSe₂ monolayer, and CsPbBr₃ perovskite. All numerical values are marked as †FDTD design targets or experimentally sourced from peer-reviewed literature (ACS Nano 2022; ACS Nano 2025); no values from prototype iterations (DOI records 1–52) are adopted. This document is pre-experimental. Its objective is fabrication-ready hardware specification, not manufacturing readiness. Experimental validation is scheduled for Phase 0 PoC. 4. Source of Truth Declaration This document supersedes all prior working materials in this research series. Only values confirmed in the six verified design documents dated 2026-02-14/15 are adopted as valid hardware bases. All prototype-era constants (DOI records 1–52) are formally superseded by this submission. 5. Keywords polariton cavity · BIC metasurface · phononic shield · Ru/Graphene · DBR reflector · diamond anvil cell · room-temperature coherence · quantum interconnect · SVRN_K0 · GDS layer stack 6. Related Works (Same Series) Paper 0: Bottleneck Intelligence — 10.5281/zenodo.18688294 Paper I: Quantum Bankruptcy of Copper Interconnects — 10.5281/zenodo.18687866 Series Root DOI: 10.5281/zenodo.18325543 AUTH: MDK_v1 | MINSU_CHO | KR_10-2026-0017941

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2026-02-19
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