A dataset from semiconductor assembly and testing processes
收藏IEEE2020-04-23 更新2026-04-17 收录
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https://ieee-dataport.org/open-access/dataset-semiconductor-assembly-and-testing-processes
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资源简介：
A dataset from semiconductor assembly and testing processes is used to evaluate the model selection prediction method. The response variable refers to the throughput rate of a specific machine–product combination in one of the assembly and testing process steps based on historical data. This data set includes 1 response variable, 5 categorical machine and product attributes and 11 numerical attributes. The dataset contains 13186 observations.
提供机构：
Yu, Cheng-Juei
创建时间：
2020-04-23
