Adhesive tape

SUBJECT of the Invention When you obtain components by process， provide the adhesive tape exactly suppressed or prevented in the trouble resulting from the curvature of the semiconductor substrate which arises by this process. PROBLEM to be solved The adhesive tape 200 is with the base material 82， The adhesion layer 81 laminated|stacked on one side of this base material 82 is provided， It is used when temporarily fixing at least 1 sort(s) of a board|substrate and the components on the adhesion layer 81， The adhesion layer 81 contains the base resin which has adhesiveness， and a tackifier， The adhesive force with respect to a mirror wafer when the adhesive tape 200 is stripped off in a 180 degrees direction from a mirror wafer is 1000cN/25 mm or more and 2100cN/25 mm or less， And it is complied with on JISZ0237， The said adhesive tape is affixed on a SUS board in 25 mm in width|variety， and the area of length 25mm under 23 degreeC， It is tape shift|deviation amount 0mm - 0.5mm from the SUS board at the time of leaving still for 3 hours， having applied a 2-kg load to the lower end of the said adhesive tape. SELECTED DRAWINGS FIG. 2 [MAT_IMAGE 000002]