Bead-Resolved Prediction of Warpage, Residual Stress, and Predicted Failure-Critical Locations in Metal-Filled PLA Additive Manufacturing

Description

This dataset supports the study on bead-resolved digital twin modeling for predicting warpage in metal fused filament fabrication (FFF). It contains geometry, simulation inputs, and post-processed results used to quantify thermo-mechanical deformation driven by bead-scale morphology and deposition sequencing.

The dataset includes:

Reconstructed geometries

Bead-resolved voxelized and/or mesh representations derived from G-code toolpaths

Super-elliptic bead parameterization capturing filament cross-sectional shape

Simulation inputs

Process parameters (layer height, bead width, deposition order)

Material properties for metal–polymer systems (e.g., IN718–PLA, Cu–PLA)

Thermal boundary conditions and activation sequences

Mechanical / warpage results

Predicted displacement fields

Distortion metrics and global warpage indicators

Eigenstrain-based deformation fields (if applicable)

Validation data

3D scan-derived geometries of printed specimens

Registered deviation maps between simulation and experiment

Methodology Summary

The digital twin reconstructs deposited filaments directly from toolpath data using a bead-resolved representation. A voxel-based transient thermal simulation is performed with activation synchronized to deposition order. Resulting thermal histories are mapped to a mechanical model to predict residual stress-induced deformation and warpage.