Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan
收藏NIST Chemistry WebBook2024-09-24 更新2026-03-14 收录
下载链接：
https://data.nist.gov/od/id/mds2-2948
下载链接
链接失效反馈官方服务：
资源简介：
The data are associated with Figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023.
