Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan
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The data are associated with Figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023.
