Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly
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https://curate.curtin.edu.au/articles/conference_contribution/Bond_Layer_Properties_and_Geometry_Effect_on_Interfacial_Thermo-mechanical_Stresses_in_Bi-material_Electronic_Packaging_Assembly/31688524
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资源简介：
Bond Layer Properties and Geometry Effect on Interfacial Thermo-mechanical Stresses in Bi-material Electronic Packaging Assembly
创建时间：
2026-03-27
