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DTPAA CHIP EXPERIMENT, CRISTALLINA, X,Y SPACING 100,100

NIAID Data Ecosystem2026-05-10 收录

晶体材料芯片实验

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数据链接：

https://www.rcsb.org/structure/9GT8 数据链接链接失效反馈

官方服务：

资源简介：

DTPAA CHIP EXPERIMENT, CRISTALLINA, X,Y SPACING 100,100

应用场景：

创建时间：

2025-10-29

纳米制造工艺

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Source data for Figure 5 of the manuscript. Contains SEM images of nanofabricated structures, as well as MATLAB figures containing data as these figures appear in the manuscript.

DataCite Commons2021-10-08 更新80

3D depth measurement of an etched silicon wafer sample.

半导体工艺检测

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3D depth measurement of an etched silicon wafer sample.

Figshare2016-11-10 更新30

The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures

焊料蠕变性能

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he data released here is for the paper "The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures". DOI: : 10.1007/s11664-020-08697-4 Tianhong Gu1*, Christopher M. Gourlay1, and T.

NIAID Data Ecosystem20

L2 Section, Sample 19. 24 Year Old Female

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三维成像

A 3 mm thick para-sagittal slice of L2 vertebra from an 24 year old female embedded in PMMA then micro-milled block surfaces carbon coated for quantitative 20kV BSE SEM. Later polished to remov

Figshare2020-03-12 更新50

Characterization of a sorter1 hologram

光学角动量分选器

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This dataset contains a series of TEM images characterizing a fan-out version of the first element of an OAM sorter.

NIAID Data Ecosystem30