The data of the article “System multi-scale analysis of temperature control for spaceborne electronic devices”

The dataset was processed and visualized using Ansys-Icepak, origin, and SPSS software.The simplifiedmodelreport.summ and detailedmodelreport.summ files are the data of the chip name and the maximum temperature of the chip in the system-level simplified model and the detailed model,respectively, which are the data in Table 2 of this document.The files in Figure 5a, Figure 5b, Figure 5c, and Figure 5d are the data (.poju, origin) of the temperature in the time and frequency domains of the system-level simplified model under the temperature control of the composite phase change insulation material and the vacuum insulation board material, i.e., the data in Figure 5 of this paper.The sensitivity.csv document is the data (.csv, SPSS) of the radiative heat transfer rate and core element temperature of the different chambers in the selected scheme of the key insulated chambers in Section 4.1, which is the data in Table 5 of this paperThe Figure 8 file is the data (.poju, origin) of the different layout coordinates of the thermal control device and the corresponding maximum temperature and temperature uniformity coefficient of the PCB board in the optimization of the spaceborne passive thermal control device in Section 4.2, that is, the data of Figure 8 in this paper.