探测器芯片非气密性封装可靠性数据

机械冲击前测试为可靠性测试前的性能数据，进行了机械冲击以及变频振动后的性能测试数据为变频振动后测试文件夹数据，变频振动文件夹数据为变频振动测试过程数据，ESD阈值测试后数据为ESD测试后芯片性能数据。The performance data collected before mechanical shock refers to the performance data collected prior to reliability testing. The performance test data obtained after both mechanical shock and variable frequency vibration corresponds to the dataset in the post-variable-frequency-vibration test folder. The data stored in the variable frequency vibration test folder is the process data generated during the variable frequency vibration test. The data collected after the ESD threshold test is the chip performance data obtained after the ESD test.

搜集汇总

背景与挑战

背景概述

该数据集提供了探测器芯片在非气密性封装下的可靠性测试数据，包括机械冲击前、变频振动后以及ESD阈值测试后的性能数据。数据集由王亮创建，数据量为35.69MB，包含8个文件，用于支持芯片可靠性分析。