高速融合互连接口控制器FPGA原型测试数据集

本课题成果对数据中心、HPC和多路服务器互连接口控制器具有高带宽、低延迟、高可靠和高可用等方面迫切需求。互连接口控制器首先需要探索融合互连接口架构，不仅满足数据中心高带宽低成本要求，而且支持HPC和处理器直连高性能、低延迟、高可靠传输。架构基础上需要研究控制器与PHY接口技术实现控制器与PHY适配，同时研究多条链路绑定技术提高聚合带宽，研究高效编解码与并行流水线结构实现低延迟互连。数据集名称：超高速互连芯片原型及应用演示样机测试数据集，主要测试了绑定宽度、端口模式配置、端口最小穿透延迟、等10项指标。This research outcome addresses the urgent demands for high-bandwidth, low-latency, high-reliability, and high-availability interconnection interface controllers in data centers, high-performance computing (HPC), and multi-socket servers. The interconnection interface controller first requires exploring a converged interconnection architecture, which not only meets the high-bandwidth and low-cost requirements of data centers, but also supports high-performance, low-latency, and highly reliable transmission for direct connections between HPC systems and processors. Based on this architecture, it is necessary to study the controller-PHY interface technology to achieve controller-PHY adaptation, meanwhile research multi-link bonding technology to increase aggregated bandwidth, and investigate efficient encoding/decoding and parallel pipeline structures to realize low-latency interconnection. The dataset is named Test Dataset for Ultra-high-speed Interconnection Chip Prototype and Application Demonstration Prototype, which mainly tests 10 indicators including bonding width, port mode configuration, minimum port penetration latency, and others.

搜集汇总

背景与挑战

背景概述

该数据集针对数据中心、高性能计算和多路服务器的互连接口控制器，旨在满足高带宽、低延迟、高可靠和高可用的需求。它探索了融合互连接口架构，并测试了绑定宽度、端口模式配置、端口最小穿透延迟等多项关键性能指标。