可用于高过载高冲击环境的柔性器件测试数据集

本数据集包含高过载高冲击环境的柔性器件测试数据的全部测试数据，主要包含弯曲半径优于1cm数据项、高过载适应性数据项和高g值冲击适应性数据项。测试采用半导体分析仪（型号:4200-SCS）进行I-T数据测试，具体为设置器件的环境温度为290K-380K（其中，弯曲半径优于1cm：290K-380K，高过载适应性和高g值适应性：290K-350K）在柔性器件两侧加载-10V的直流偏压，测量输出电流随时间的变化关系，采样时间范围待输出电流稳定后进行20-45s的数据采样，时间精度设置约为0.6s，测试点分布在柔性器件的电极表面，测试点的范围为半径为15μm的圆域This dataset contains all test data of flexible devices under high-overload and high-impact environments, mainly including three categories of data items: data with bending radius better than 1 cm, high overload adaptability data, and high-g impact adaptability data. The I-T (current-time) measurements were conducted using a semiconductor parameter analyzer (model: 4200-SCS). Specifically, the ambient temperature of the test devices was set to 290 K–380 K, with tailored temperature ranges for each category: 290 K–380 K for the group with bending radius better than 1 cm, and 290 K–350 K for the high overload adaptability and high-g impact adaptability groups. A DC bias voltage of -10 V was applied to both sides of the flexible devices, and the variation of output current over time was measured. Data sampling was performed for 20–45 s after the output current stabilized, with a time precision of approximately 0.6 s. Test points were distributed on the electrode surfaces of the flexible devices, with each test point being a circular area with a radius of 15 μm.

搜集汇总

背景与挑战

背景概述

该数据集包含用于高过载和高冲击环境的柔性器件测试数据，主要涵盖弯曲半径、高过载适应性和高g值冲击适应性三类测试项。测试采用半导体分析仪在特定温度范围和直流偏压下测量输出电流随时间的变化，数据量约为469.69KB，适用于电子元件与器件技术领域的研究。