Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm
收藏Mendeley Data2024-01-31 更新2024-06-26 收录
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资源简介：
Data accompanied with the paper 'Defect inspection of solder bumps using the scanning acoustic microscopy and fuzzy SVM algorithm'. Figure 1 is the original C-scan SAM image of the FA10 flip chip sample. Table 1 shows the numerical values of the features.
创建时间：
2024-01-31
