ENVIRONMENTAL X-RAY COMPUTED TOMOGRAPHY (E-CT): 3D CT AT ELEVATED TO CYROGENIC TEMPERATURES

While 2.5D and 3D solutions continue to drive advancements in the electronics packaging industry, challenges persist with their reliability and qualification [1-3]. In this paper, we introduce a new technique that may prove valuable for nondestructive, in-situ measurements of package and die warpage.This system allows for the powerful visualization tools of Computed Tomography to be applied to samples at elevated and cryogenic temperatures over a broad temperature range (+125C to -257C).