In-situ study of creep in Sn-3Ag-0.5Cu solder
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https://zenodo.org/record/3901663
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资源简介：
The data released here is for the paper "In-situ study of creep in Sn-3Ag-0.5Cu solder". DOI: 10.1016/j.actamat.2020.06.013
Tianhong Gu1*, Vivian S. Tong1,2, Christopher M. Gourlay1, and T. Ben Britton1
Department of Materials, Imperial College London, SW7 2AZ. UK
Now at: National Physical Laboratory, Hampton Rd, Teddington TW11 0LW, UK
*Corresponding author: t.gu15@imperial.ac.uk, +44 20 7594 2634
*.bcf = Bruker BCF data for full EBSD map to plot EBSD maps
*.csv = spreadsheet of graphical data for plots in Fig2 (creep curves), Fig10 and Fig11 (Schmid factors and slip systems)
*.tif = images used to to build up Figures (the figures are presented in the powerpoint)
The data bundle was prepared by Tianhong Gu
创建时间：
2020-06-19
