Impact of Interconnection Failure on Photovoltaic Module Performance

This data set consists of illuminated and dark current-voltage (I-V), suns-Voc, and EL images for a set of modules used in an interconnection study. Four 60-cell, multicrystalline Al-BSF modules were systematically cut from the rear side to inflict interconnection failures, resembling solder bond failures in the field. The cutting procedure is described in experiment PowerPoint.<br>Illuminated I-V, suns-Voc, and the summary_IV_performance spreadsheet were obtained from the Sinton FMT-350 tool.<br>The EL images in this set are taken as "EL sweeps," in which for each set of images, a series of individual images using increasing bias currents are obtained. This is used for calibrated EL image analysis to extract dark I-V from each cell using the module level images. Images were obtained using an 8MP cooled Si CCD camera with an 850nm longpass filter.