Global Semiconductor Packaging Equipment Market 2016-2020

#Snapshot img { margin: 10px !important; } Global outlook for the semiconductor packaging equipment marketTechnavio’s market research analysts have predicted that the global semiconductor packaging equipment market will grow steadily at a CAGR of more than 8% by 2020. This industry research report identifies the growth of wireless computing devices along with the advent of IoT to be one of the major factors that will have a positive impact on the growth of this market in the coming years. The recent years have seen a rapid increase in the demand for high-performance devices with reliable and highly portable computing platforms. IoT uses sensors and actuators to collect and transmit data from wireless computing devices to a centralized location in real-time. The increasing adoption of IoT in the consumer electronics and automotive sectors will drive the demand for wireless devices. These wireless computing devices require a high level of integration, as a result of which, semiconductor manufacturers have started developing new designs to support multiple applications on a single platform. Such developments will lead to the purchase of new IC packaging equipment that can match the changing technological environment.This market research and analysis states that in terms of geography, APAC will dominate the market during the forecast period and will account for more than 72% of the total market shares by 2020. This is mainly due to the presence of several major foundries that invest heavily in revamping their production lines, subsequently creating the demand for production equipment. Owing to the presence of major consumer electronics manufacturers, this region is the largest consumer of semiconductor devices, which will also drive the demand for semiconductor packaging equipment.Competitive landscape and key vendorsCharacterized by the presence of several well-established, small scale, and regional vendors, the market appears to be highly fragmented. The market is currently migrating to 3D IC technology, which is increasing the competition between the IDMs and OSATs. IDMs are trying to expand into the assembly business, while the OSATs are concentrating on increasing their profit margins. Currently, OSATs account for a significant share of the market and the huge growth potential will induce IDMs to expand their business to the semiconductor packaging equipment market. As a result, the vendor competition in the market will intensify during the forecast period. To retain their market share and acquire new technologies, major vendors have started undertaking M&A practices and joint ventures with small and regional vendors. This trend will continue during the predicted period and will reduce the number of new and small vendors, resulting in market consolidation.The leading vendors in the market are -Applied MaterialsASM Pacific TechnologyKulicke & Soffa IndustriesTokyo ElectronTOKYO SEIMITSUThe other prominent vendors in the market are ChipMos, Greatek, Huanhong, Jiangsu Changjiang Electronics Technology, Lingsen Precision, Nepes, Tianshui Huatian, Unisem, and Ultratech.Segmentation by type and analysis of the semiconductor packaging equipment marketDie-level packaging equipmentWafer-level packaging equipmentAccounting for more than 61% of the total market shares, the die-level packaging equipment segment dominated the market during 2015. This growth can be attributed to the increasing demand for application processors, basebands, and SoCs, which are integrated into mobile and consumer electronic devices. Though the market shares of this segment will decline due to the use of advanced technologies, this segment will continue to dominate the market throughout the forecast period.Segmentation by end-user and analysis of the semiconductor packaging equipment marketIDM (integrated device manufacturers)OSAT (outsourced semiconductor assembly and test companies)According to this market study, the OSATs will account for more than 63% of the total market shares by 2020 and will also dominate the semiconductor packaging equipment market throughout the predicted period. The migration of a number of semiconductor manufacturers to the fabless model is identified to be the major factor for the growth of the market segment. Additionally, the development of new technologies such as FOWLP, 2.5D, and TSV has also increased the outsourcing of back-end processes, which will also fuel the growth of this market segment.Key questions answered in the report includeWhat will the market size and the growth rate be in 2020?What are the key factors driving the global semiconductor packaging equipment market?What are the key market trends impacting the growth of the global semiconductor packaging equipment market?What are the challenges to market growth?Who are the key vendors in the global semiconductor packaging equipment market?What are the market opportunities and threats faced by the vendors in the global semiconductor p

全球半导体封装设备市场展望
Technavio市场研究分析师预测，到2020年，全球半导体封装设备市场将稳步增长，年复合增长率将超过8%。本行业研究报告指出，无线计算设备的增长以及物联网的兴起是未来几年推动该市场增长的主要因素之一。近年来，对高性能、可靠且高度便携的计算平台的需求迅速增加。物联网通过传感器和执行器实时收集和传输无线计算设备的数据至集中位置。物联网在消费电子和汽车领域的日益普及将推动无线设备的需求。这些无线计算设备需要高度集成，因此，半导体制造商已经开始开发新的设计方案，以支持单平台上多种应用。此类发展将导致购买能够适应不断变化技术环境的新IC封装设备。该市场研究和分析指出，从地理角度来看，亚太地区将在预测期内占据市场主导地位，并将在2020年占据超过72%的市场份额。这主要归因于该地区存在多个主要晶圆厂，它们大量投资于改造其生产线，从而创造了生产设备的需求。由于该地区拥有主要的消费电子制造商，该地区是半导体器件的最大消费者，这也将推动半导体封装设备的需求。竞争格局和主要供应商
该市场由多个已建立、小型和区域供应商组成，呈现出高度分散的态势。目前，市场正转向3D IC技术，这加剧了IDMs和OSATs之间的竞争。IDMs正试图扩大其封装业务，而OSATs则专注于提高其利润率。目前，OSATs占据了市场的重要份额，巨大的增长潜力将促使IDMs扩大其业务至半导体封装设备市场。因此，在预测期内，市场中的供应商竞争将加剧。为了保持其市场份额并获取新技术，主要供应商已经开始与小型和区域供应商进行合并收购和合资。这一趋势将在预测期内持续，并将减少新和小型供应商的数量，导致市场整合。市场中的领先供应商包括——
Applied Materials
ASM Pacific Technology
Kulicke & Soffa Industries
Tokyo Electron
TOKYO SEIMITSU
市场上的其他主要供应商包括ChipMos、Greatek、Huanhong、江苏长江电子科技、Lingsen Precision、Nepes、Tianshui Huatian、Unisem和Ultratech。按类型细分的市场和半导体封装设备市场分析
晶圆级封装设备
晶圆级封装设备
占市场总份额61%以上的晶圆级封装设备细分市场在2015年占据了市场的主导地位。这种增长可以归因于对应用处理器、基带和SoC的需求不断增加，这些设备被集成到移动和消费电子设备中。尽管由于采用先进技术，该细分市场的市场份额将下降，但在此预测期内，该细分市场将继续占据市场的主导地位。按最终用户细分的市场和半导体封装设备市场分析
IDM（集成器件制造商）
OSAT（外包半导体封装和测试公司）
根据本市场研究，到2020年，OSATs将占据总市场份额的63%以上，并在预测期内继续主导半导体封装设备市场。许多半导体制造商转向无晶圆厂模式的迁移被认为是市场细分增长的主要因素。此外，FOWLP、2.5D和TSV等新技术的开发也增加了后端过程的外包，这也将推动该市场细分的发展。
本报告回答的关键问题包括：
2020年市场的规模和增长率将是多少？
推动全球半导体封装设备市场增长的关键因素是什么？
影响全球半导体封装设备市场增长的关键市场趋势是什么？
市场增长面临的挑战是什么？
全球半导体封装设备市场中的主要供应商是谁？
全球半导体封装设备市场中的供应商面临的市场机会和威胁是什么？