Three-Dimensional Quantum Interconnect Computing (3D-QIC): A New Architectural Paradigm for Post-Moore's Law Performance Scaling

As transistor scaling approaches fundamental physical limits, the paradigm of Moore's Law is becoming unsustainable. This manuscript introduces Three-Dimensional Quantum Interconnect Computing (3D-QIC), a feasible architectural solution designed to deliver massive performance multiplication. We present the core mathematical framework—including quantum tunneling probabilities, electron transport models, and thermal equations—that underpins the 3D-QIC concept, while also addressing quantum-level challenges such as crosstalk interference. The transformative innovation lies in Quantum Tunneling Interconnects (QTIs), which replace traditional Through-Silicon Vias (TSVs). Supported by this theoretical framework, simulations project that QTIs can enable vertical data transfer at unprecedented speeds and energy efficiency. A case study on AI model training suggests a potential 4x speedup with an 85\% reduction in energy consumption. Finally, we present a phased development roadmap addressing critical challenges with proposed solutions like directed self-assembly and embedded microfluidics. This work presents a credible, theoretically-grounded, and actionable roadmap for a new era of powerful computing.