COMSOL Multiphysics Model for Wireless Passive Temperature and Pressure sensors

This repository contains the COMSOL Multiphysics model (.mph) used in the paper titled “Multiphysics Analysis and Simulation of Wireless Passive Temperature and Pressure sensors for Harsh-Environment Applications”, accepted for publication in a future issue of IEEE Journal on Multiscale and Multiphysics Computational Techniques. To view the article abstract page, please use the below URL: https://ieeexplore.ieee.org/document/11286216The models include the complete geometry, material definitions, physics interfaces, boundary conditions, solver configurations, and post-processing settings used to reproduce multiphysics simulation results presented in the manuscript. The provided file enables full reproducibility of the numerical study and may serve as a reference for researchers working on the electromagnetic-thermal-mechanical multiphysics simulation of microwave sensors. Contents: Temperature_Sensor_EM_heat.mph Temperature_Sensor_thermal_stress.mph— The original COMSOL Multiphysics models used in the paper for temperature sensor simulations, evaluating the electromagnetic–thermal coupling effect and the thermal–mechanical coupling effect, respectively. Pressure_Sensor_thermal_stress.mph — The original COMSOL Multiphysics model used in the paper for pressure sensor simulations, evaluating the thermal–mechanical coupling effect. Compatible version: COMSOL Multiphysics 6.0 Required physics modules: RF Module, Heat Transfer Module, and Structural Mechanics Module Usage Instructions:Open the Temperature_Sensor/Pressure_Sensor.mph file using COMSOL Multiphysics 6.0. All simulation settings and solver sequences are preconfigured. Users may modify parameters or geometry as needed. Citation:If you use this model in your work, please cite the associated paper and this Zenodo dataset using the DOI provided.