Electrodeposited copper film data

The five types of surface roughness of the electroplated copper films was measured using a white light interferometer (Ametek). Each electrodeposited copper film was obtained via constant-current electrolysis in copper sulfate bath. The concentrations of sulfuric acid (H2SO4) and copper sulfate (CuSO4) were in the ranges of 20–180 g/L and 140–220 g/L, respectively. Standard additives for copper sulfate bath (JCU, CU-BRITE_RF) and 50 ppm chloride ions were introduced into the bath to ensure the stable formation of the electrodeposited copper film. A 70 mm × 70 mm sized masked copper plate was used as the working electrode and a Ti-coated mesh was used as the counter electrode. The electrodeposition time was controlled such that the total capacity was 8.1 C/cm2.