In-situ observation of grain boundary formation and strain gradient evolution...
收藏B2FIND2026-04-25 收录
下载链接：
https://b2find.eudat.eu/dataset/931bb6b2-ed58-5fc1-88ba-764276c73682
下载链接
链接失效反馈官方服务：
资源简介：
Interconnect copper lines represent a key component of microelectronic devices, which undergo severe thermal fatigue damage, resulting in a microstructural refinement and...
