Data underlying the PhD dissertation 'Low-temperature nanoparticles sintering technology in heterogeneous integration'

The following dataset corresponds to the source of the plots and SEM images used in the PhD dissertation titled "Low-temperature nanoparticles sintering technology in heterogeneous integration".<br>In this dissertation, investigation at the atomic level on microstructure evolution, mechanical, and anti-corrosion performance was conducted by employing the atomistic simulation. The revealed relationship between microstructure and performance can boost material and process optimization. In the experiments, thermal and mechanical properties at the microscale and macroscale on the low-temperature sintered structure were characterized, where an Anand model was proposed. This information improved the understanding of failure mechanisms under certain loading, which reduced the barrier to applying the technology in different use cases. Beyond the zero-hour performance, the online thermal impedance monitoring methodology is implemented on the sintered joint to better understand the performance degradation. Consequently, power device packaging and hermetic packaging applications are achieved, indicating low-temperature sintering technology as a reliable and versatile technology in heterogeneous integration.

本数据集对应题为《异质集成中的低温纳米颗粒烧结技术》的博士学位论文中所用绘图与扫描电子显微镜（SEM）图像的来源。
该论文通过原子模拟手段，针对微观结构演化、力学性能与耐腐蚀性能开展了原子尺度的研究。所揭示的微观结构与性能之间的关联，可助力材料与工艺的优化。
实验中，研究人员针对低温烧结结构的微尺度与宏尺度热学、力学性能开展了表征，并提出了阿南德（Anand）模型。该信息加深了对特定载荷下失效机制的理解，降低了该技术在不同应用场景中推广应用的壁垒。
除零小时性能外，研究团队还在烧结接头中实现了在线热阻抗监测方法，以更好地理解性能退化规律。
最终，功率器件封装与气密封装的应用得以实现，表明低温烧结技术是异质集成领域中一种可靠且通用的技术。