Measurement of thermal conductivity of epoxy resins during cure
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https://dspace.lib.cranfield.ac.uk/handle/1826/22054
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资源简介：
- -Thermal_conductivity_glycerine:
Experimental and FE data of the thermal conductivity test run on glycerine at
100 degC and 4 degC. Includes also the sensitivity analysis of the measurement on
thermocouple misplacement.<br>
- -RTM6_cure_kinetics_results:
Includes the isothermal and dynamic data for the RTM6 cure kinetics
characterisation and the corresponding model. It also includes the sensitivity
analysis on period and amplitude influence for RTM6<br>
- - 890RTM_cure_kinetics_results:
Includes the isothermal and dynamic data for the 890RTM cure kinetics
characterisation and the corresponding model. It also includes the sensitivity
analysis on period and amplitude influence for 890RTM<br>
- - XU3508_cure_kinetics_results:
Includes the isothermal and dynamic data for the XU3508 cure kinetics
characterisation and the corresponding model. <br>
- -Di Benedetto_XU3508:
Includes the dataused to build the Di Benedetto equation for the XU3508 resin
system and the corresponding model<br>
- - Cp_density_conductivity_data:
Includes the Cp data and model, the density and the thermal conductivity data
for the three resin systems under investigation: RTM6, 890RTM and XU3508<br>
- -Thermal_conductivity_model:
Includes the data from the thermal conductivity tests for the three resin
system and the fitting of the experimental data with the analytical model.
提供机构：
Cranfield University
创建时间：
2018-07-12
