Experimental study on CPU cooling with thermoelectric intergraded with heat pipes.
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http://www.iifiir.org/clientBookline/service/reference.asp?INSTANCE=EXPLOITATION&OUTPUT=PORTAL&DOCID=IFD_REFDOC_0016247&DOCBASE=IFD_REFDOC&SETLANGUAGE=FR
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资源简介：
The CPU cooling with thermoelectric intergraded with heat pipes (HP+TEC) is developed in this study. In order to clearly investigate its performance, the traditional fin-type heat sink (HS) and fin-type heat sink with TEC (HS+TEC) are developed. The temperature of CPU is tested under different load conditions in HS. And then, the variations of temperatures of cold side, hot side and air in case are investigated under different load conditions at different set temperature (Tset) as well as COP. The results show that the HP+TEC can effectively dissipate the waste heat without effecting other parts in case. Moreover, the COP can be up to 2.0 at full load condition at Tset=30°C.
提供机构：
International Institute of Refrigeration (IIR)
创建时间：
2016-09-07
