AFM imaging of surface of modern soldering alloy

Following the announcement in 2006 of European Union directives aimed at limiting the use of lead in electronic products, there was an urgent need to use lead-free solders in the electronics industry. Due to production requirements, it is necessary to use solders with different melting points. To replace the low-melting eutectic Sn 37 wt. Pb, the most promising candidates are Sn 3.0 wt.%. Ag 0.5 wt.% Cu and other alloys of these metals. On the other hand, tin and antimony is one of the most promising candidates for the replacement of the alloy with a high melting point Sn - 95 wt. Pb [1]. The aim of this microscopic study was to show the microstructure of welds made with the new high-melting brazing material, thanks to which it is possible to assess their defects and heterogeneity. Thanks to this type of imaging, it will be possible to predict the mechanical properties and lifetime of the obtained joints. Topographic measurements were made in the contact mode with the use of a CSG30 probe. The file contains 12 images.
[1]       C.Y. Lin, C. Lee, X. Liu, Y.W. Yen, Phase equilibria of the Sn-Sb-Ag ternary system and interfacial reactions at the Sn-Sb/Ag joints at 400 °C and 150 °C, Intermetallics. 16 (2008) 230–238. doi:10.1016/j.intermet.2007.10.002.