Investigation of tin whisker growth behavior in COTS components under thermal vacuum cycling
收藏DataCite Commons2025-08-27 更新2026-05-05 收录
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资源简介：
Tin whisker growth in COTS components was studied under thermal vacuum and air cycling. Results show higher susceptibility in ceramic capacitors, stress-driven mechanisms as the main cause, and faster growth in vacuum due to thinner oxide films.
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创建时间：
2025-08-27
