试制自研IGBT数字驱动芯片功率模块数据集

本数据集收集了2023年1月至2025年8月期间采用自研IGBT数字驱动芯片进行柔性直流输电用4500V IGBT功率模块和6500V IGBT功率模块试制产生的设计和测试数据。针对4500V IGBT和6500V IGBT分别开展了功率模块的电气设计、结构设计、控制保护和可靠性提升设计以及性能验证，通过元器件与二次板的适配性选型构建了功率模块的基本电气回路，辅以电场仿真与热力学仿真，论证了二次板卡抗干扰设计的有效性以及功率器件的散热设计的有效性。由西安高压电压研究院股份有限公司完成了试制的两种功率模块的性能试验并出具了试验报告。

This dataset collects design and test data generated during the prototype development of 4500V and 6500V IGBT power modules for flexible DC transmission, which were developed using the independently developed IGBT digital drive chips, spanning from January 2023 to August 2025. For the 4500V and 6500V IGBTs, separate electrical design, structural design, control and protection design, reliability improvement design and performance verification of the corresponding power modules were conducted. The basic electrical circuits of the power modules were established via adaptive selection of components and secondary boards, and supported by electric field simulation and thermodynamic simulation, the effectiveness of the anti-interference design of the secondary boards and the heat dissipation design of the power devices was verified. The performance tests of the two prototype power modules were completed by Xi'an High Voltage Research Institute Co., Ltd., which also issued the corresponding official test reports.

搜集汇总

背景与挑战

背景概述

该数据集收集了2023年1月至2025年8月期间，针对柔性直流输电用的4500V和6500V IGBT功率模块试制过程的设计与测试数据，涵盖电气设计、结构设计、控制保护及性能验证等关键环节。数据集来源于国家重点研发计划项目，包含37个文件（约337.7MB），格式多样，旨在支持高压大功率IGBT数字驱动芯片的技术研发和验证。