Data on mechanical and thermal properties of an amine-epoxy system at various post-curing temperatures

A data set compilation of the mechanical and thermal properties of a commercial thermoset system was obtained after exposure to a room temperature cure followed by different post-cures (80, 100, 120 °C), all below the fully cured glass transition temperature (Tg∞ ~ 153°C). The system was composed of an epoxy resin, diglycidyl ether of bisphenol A (Epon 828), and an amine hardener, diethylenetriamine (Epikure 3223). The mechanical properties of this epoxy system were determined through dynamic mechanical analysis (DMA) and flexural testing, while its thermal behavior was evaluated by differential scanning calorimetry (DSC), thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). The data was analyzed using analysis of variance (ANOVA) to assess if the selected post-curing temperatures provoke a statistically significant difference on the corresponding properties.