LEGO-like three-dimensional integrated stretchable electronics

Stretchable electronics have attracted significant attention owing to their unique mechanical flexibility, promising performance, and wear comfort. However, the reliance on single-layer architectures restricts their integration density, and mechanical incompatibility between rigid components and soft substrates limits their service life. To address these challenges, we developed a LEGO-like modular assembly strategy for constructing multilayer three-dimensional (3D) stretchable electronics. In this approach, electronic components (ECs) and self-healing polyurethane (SPU) substrates patterned with liquid metal (LM) circuits function as the LEGO blocks. This modular assembly design simplifies fabrication and enhances the 3D integration density. In addition, the combination of liquid metal circuits and self-healing elastic substrates allows the devices to withstand diverse deformation conditions and facilitates autonomous healing after mechanical damage. Notably, the fabricated devices can undergo multiple recycling and reuse cycles. The design concept and methodology presented here propose a new approach for developing advanced flexible electronics.