Ultrahigh vacuum packaging and surface cleaning for quantum devices

Name: Ultrahigh vacuum packaging and surface cleaning for quantum devices
Creator: IBM Quantum, IBM Research Europe–Zurich, Säumerstrasse 4, 8803 Rüschlikon, Switzerland; IBM Quantum, IBM Thomas J. Watson Research Center, Yorktown Heights, New York 10598, USA
Published: 2021-02-23T00:00:00+08:00

Zenodo2021-02-23 更新2026-04-07 收录

量子器件封装

表面清洁工艺

数据链接：

https://zenodo.org/record/5503995 数据链接链接失效反馈

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资源简介：

Datasets associated with the paper "Ultrahigh vacuum packaging and surface cleaning for quantum devices". Datasets for the plots in Figures 4, 5, 6 and Table I are provided. Toc.pdf links the data to the figures and adds information on how the data can be reproduced.

提供机构：

IBM Quantum, IBM Research Europe–Zurich, Säumerstrasse 4, 8803 Rüschlikon, Switzerland; IBM Quantum, IBM Thomas J. Watson Research Center, Yorktown Heights, New York 10598, USA

创建时间：

2021-02-23

Ultrahigh vacuum packaging and surface cleaning for quantum devices

资源简介：

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