Data for: "Test Structures for Developing Packaging for Implantable Sensors"
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资源简介：
This dataset relates to the publication "Test Structures for Developing Packaging for Implantable Sensors". It contains data recorded using microelectronic test structures for the purpose of characterising implantable sensor packaging. The data includes leakage current measurements to assess insulation integrity, reflectometer measurements to determine surface cleanliness after packaging, and electrical measurements for wire bond continuity.
创建时间：
2020-04-15
