CURABLE RESIN COMPOSITION， DRY FILM， CURED PRODUCT AND ELECTRONIC COMPONENT
收藏国家林业和草原科学数据中心2023-02-12 更新2024-03-07 收录
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资源简介：
PROBLEM TO BE SOLVED: To provide a curable resin composition that is suitable for obtaining a cured product that， while maintaining low thermal expansion coefficients， has low elasticity， and is excellent in both of toughness (flexibility) and low water absorption， and a dry film， a cured product and an electronic component including the same. SOLUTION: The present invention provides a curable resin composition or the like containing an epoxy compound， an episulfide compound， a fine cellulose powder with at least one-dimension of it being smaller than 100 nm， and a filler other than the fine cellulose powder. SELECTED DRAWING: None
提供机构：
国家林业和草原科学数据中心
创建时间：
2023-02-12
