Development of a Microstrip Resonator Using Additive Methods of SLA Printing and Extrusion of Pastes

The development of a new resonant microstrip structure based on the compatibility of various 3D-printing methods: SLA printing of ceramic substrates and extrusion of conductive pastes is presented. The conducted measurements of the quality factor of the obtained structure show its efficiency in comparison with similar developments. The work emphasizes the importance and prospects of using the described 3D-printing methods in manufacturing of new microstrip structures for the microwave path. The application of these technologies allows manufacturing a prototype device and its preliminary testing in the short-term.