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何謂無塵室潔淨室清淨室?

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sdcrp.com.tw2025-01-20 收录
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無塵室,又稱淨室、潔淨室或清淨室,是指一個具有低污染水準的環境,這裡所指的污染來源有灰塵,空氣傳播的微生物,懸浮顆粒,和化學揮發性氣體。更準確地講,一個無塵室具有一個受控的污染級別,污染級別可用每立方米的顆粒數,或者用最大顆粒大小來厘定的。低階別的無塵室通常是沒有經過消毒的(如沒有受控的微生物),更在意的是無塵室中的灰塵。淨室的定義為:將空間範圍內之空氣中的微塵粒子等污染物排除,而得到一個相當潔淨的環境。亦即:這個環境中的微塵粒子相當少,稱之為無塵室。無塵室被廣泛地應用在對環境污染特別敏感的行業,例如半導體生產、生化技術、生物技術、精密機械、製藥、和醫院內的手術室等行業等,其中以半導體業其對室內之溫濕度、潔淨度要求尤其嚴格、故其必需控制在某一個需求範圍內,才不會對製程產生影響。作為生產設施,無塵室可以佔據廠房很多位置。 無塵室系統無塵室系統,製造符合規格之潔淨空氣,連續且穩定供給足夠之潔淨空氣於使用端,無塵室內的製造區(FAB)。一般而言,製造潔淨空氣之氣源為外氣(OUTSIDEAIR),經過無塵室系統各種處理單元裝置之處理後進而得到符合規格之潔淨空氣。以下簡單介紹其處理流程:外氣經由外氣空調箱(Make-upAirUnit或MAU)初步過濾微塵(particle)並控制其溫溼度後,經由回風管道間(Mech.Chase),將無塵室之循環風量與外氣空調箱之補充風量混合,經由冷卻盤管(DryCoolingCoil)將回風管道間之回風降溫至無塵室要求之規格,透過循環風扇(FanFilterUnit或FFU)帶動無塵室的氣流循環帶走微塵及熱量,最後經過超高效能過濾網(Ultra-lowpenetrationair或ULPAFilter)過濾後,供應至Fab區。無塵室空調的特性溫溼度要求比一般空調高一般空調要求在18°C~26°C之間,相對溼度則在40%~65%之間;無塵室空調必須控制在22°C~24°C之間,相對溼度則在45%~55%。恆溫恆溼控制由於半導體製程對溫溼度變化的大小極為敏感,故在無塵室大部分割區域必須控制在±1°C及±3%之內。所需的外氣較多由於半導體工廠中,製程系統需使用大量的化學品和毒氣,這些化學品和毒氣所產生的揮發氣體和廢氣必須予以全數排除,故排氣量相當大,為維持無塵室壓力比外面的大氣壓力大,此時所補充的空氣量亦隨之增加。空調系統24小時全天運轉並監控管理半導體工廠部分製程裝置,對溫溼度變化極為敏感,如黃光區Stepper光學機台,些微的溫、溼度變化均會使裝置的準度偏差,另外晶片等產品也必須置放在定溫定溼的環境下,故空調系統必須24小時監控管理之。半導體廠無塵室室內壓力大小半導體廠無塵室室內壓力必須比室外高些許,除了為避免室外的溫、溼度、微粒影響無塵室生產區的環境條件外,並可延長無塵室ULPAfilter的壽命,但不能無條件增加,如此將使向外逸散的潔淨空氣增加而增加運轉成本。氣流分佈須均勻無塵室空調為帶走無塵室內所產生的微塵粒子以維持潔淨度故除了氣流速度須達到一定之要求標準外,氣流的流線形狀也必須依不同的無塵室等級加以適當的控制。 (參考來源:https://zh.wikipedia.org/wiki/%E5%87%80%E5%AE%A4)

Cleanrooms, also known as clean rooms, cleanrooms, or pure rooms, refer to an environment with a low level of contamination, including dust, airborne microorganisms, suspended particles, and volatile organic compounds. More precisely, a cleanroom has a controlled level of contamination, which can be determined by the number of particles per cubic meter or by the maximum particle size. Lower-grade cleanrooms are typically not disinfected (such as without controlled microorganisms) and are more concerned with dust in the cleanroom. The definition of a cleanroom is to exclude pollutants such as fine dust particles from the air within the space, thereby obtaining an environment that is quite clean. That is, the environment has a very low number of dust particles, which is referred to as a cleanroom. Cleanrooms are widely used in industries that are particularly sensitive to environmental pollution, such as semiconductor production, biotechnology, biotechnology, precision machinery, pharmaceuticals, and operating rooms in hospitals, among others. The semiconductor industry, in particular, has very strict requirements for indoor temperature and humidity, cleanliness, and therefore must be controlled within a certain range to avoid affecting the production process. As a production facility, cleanrooms can occupy a significant amount of space in a factory. Cleanroom systems Cleanroom systems are designed to produce and continuously and stably supply clean air that meets specifications to the user end, including the manufacturing area (FAB) within the cleanroom. Generally, the source of clean air production is outside air (OUTSIDE AIR), which is processed through various treatment units of the cleanroom system to obtain clean air that meets specifications. The following is a brief introduction to its processing process: outside air is initially filtered for fine particles and controlled for temperature and humidity by the makeup air unit (MAU), then mixed with the recirculating air volume of the cleanroom through the mechanical chase, cooled to the required specification of the cleanroom through the cooling coil (Dry Cooling Coil), and the return air from the mechanical chase is cooled down to the required specification of the cleanroom. The circulating air fan (Fan Filter Unit or FFU) drives the air flow circulation in the cleanroom to remove dust and heat, and finally, after being filtered through a high-efficiency particulate air filter (Ultra-low penetration air or ULPA Filter), it is supplied to the Fab area. Characteristics of cleanroom air conditioning The temperature and humidity requirements of cleanroom air conditioning are higher than those of general air conditioning. General air conditioning requires a temperature range of 18°C to 26°C and a relative humidity range of 40% to 65%; cleanroom air conditioning must be controlled within a range of 22°C to 24°C, with a relative humidity range of 45% to 55%. Constant temperature and humidity control Due to the extreme sensitivity of semiconductor manufacturing processes to temperature and humidity changes, the majority of cleanroom sections must be controlled within ±1°C and ±3% of the temperature and humidity. The need for more outside air Due to the large amount of chemicals and toxic gases used in the process systems of semiconductor factories, the volatile gases and waste gases produced by these chemicals and toxic gases must be completely removed, resulting in a relatively large exhaust volume. To maintain a pressure higher than that of the outside atmosphere in the cleanroom, the amount of air that is supplemented also increases. Air conditioning systems operate 24 hours a day and manage some semiconductor factory process equipment, which is extremely sensitive to temperature and humidity changes, such as the Stepper optical machine in the photolithography area. Even minor changes in temperature and humidity can cause deviations in the accuracy of the equipment. In addition, products such as wafers must also be placed in a constant temperature and humidity environment, so the air conditioning system must be monitored and managed 24 hours a day. Pressure in the cleanroom of semiconductor factories The pressure inside the cleanroom of semiconductor factories must be slightly higher than that outside, not only to avoid the impact of outside temperature, humidity, and particles on the environmental conditions of the cleanroom production area but also to extend the life of the cleanroom ULPA filter. The airflow distribution must be uniform Cleanroom air conditioning is designed to remove the dust particles generated within the cleanroom to maintain cleanliness. Therefore, in addition to meeting certain standard requirements for airflow speed, the shape of the airflow stream must also be appropriately controlled according to different cleanroom grades. (Reference: https://zh.wikipedia.org/wiki/%E5%87%80%E5%AE%A4)
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