SEPARATION OF COPPER FROM A LEACHING SOLUTION OF PRINTED CIRCUIT BOARDS BY USING SOLVENT EXTRACTION WITH D2EHPA

Abstract Global generation of waste electrical and electronic equipment (WEEE) is increasing quickly. Metals from WEEE can be recovered by using unit operations of chemical engineering. This paper describes a combined hydrometallurgical route (sulfuric oxidant leaching + solvent extraction) to recover copper from printed circuit boards (PCBs). A non-magnetic fraction from comminuted PCBs was used to perform leaching tests at 75ºC for 6 hours in an oxidizing media (sulfuric acid + hydrogen peroxide). In order to separate zinc, aluminum, and copper from the leaching liquor, solvent extraction tests were carried out using D2EHPA. Parameters that influence the process, such as pH, extractant concentration, and the aqueous/organic (A/O) ratio were investigated. Solvent extraction experiments were carried out in two stages: i) separation of zinc, aluminum, and residual iron, and ii) copper separation. The results showed that the leaching obtained around 60% aluminum, 94% copper, 76% zinc, 50% nickel and residual iron from the non-magnetic fraction of PCBs. With the solvent experiments, in the first stage, 100 wt.% zinc, iron and aluminum were extracted at pH 3.5, 2:1 A/O, 10 % (v/v) D2EHPA, while, in the second stage 100% of the copper was extracted at pH 3.5, 1:1 A/O, 20 % (v/v) D2EHPA.