Simulation on Interplay Between Morphological Evolution and Defect in Polycrystalline TSV During EM
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Animations accompany the paper "Simulation on Interplay Between Morphological Evolution and Defect in Polycrystalline TSV During EM" published in IEEE Transactions on Electron Devices ( Volume: 71, Issue: 1, January 2024) Page(s): 322 - 330 DOI: 10.1109/TED.2023.3296708
Authors: Xin Zeng; Zhiheng Huang; Shuanjin Wang; Min Xiao; Yuezhong Meng; Yang Liu
