特创科技年度PCB创新产品设计数据集
收藏资源简介:
该数据集主要包括: 1、PCB创新产品的规格,如SET长、SET宽、PNL宽、大料长宽等,避免出现混乱规格尺寸混乱,不一致。 2、PCB创新产品的研发预期,如销售订单号、市场交期、订单类别、交货形式X等,可以帮助企业制定合理的产品销售市场预期,确保产品能够满足市场需求。 3、PCB创新产品的工艺选用,如表面处理方式、完成厚度、金厚、镍厚、沉金CS面、沉金SS面、板材型号及厚度等,可以改善产品的导电性能和耐腐蚀性,降低生产过程中的废品率,从而提高了产品的最终质量和性能。
This dataset mainly includes the following contents: 1. Specifications of innovative PCB (Printed Circuit Board) products, including SET length, SET width, PNL width, raw board length and width, etc., to avoid confusion and inconsistency in specifications and dimensions. 2. R&D-related expectations for innovative PCB products, such as sales order number, market delivery date, order category, delivery form X, etc. This assists enterprises in formulating reasonable market expectations for product sales and ensuring that products meet market demands. 3. Process selections for innovative PCB products, including surface treatment method, final thickness, gold thickness, nickel thickness, electroless gold CS surface, electroless gold SS surface, board material model and thickness, etc. These parameters can improve the electrical conductivity and corrosion resistance of products, reduce the scrap rate during production, and thereby enhance the final quality and performance of the products.




