融合C波段的毫米波CMOS收发芯片
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融合C波段的毫米波CMOS收发芯片主要是面向功能复用、频段融合技术的5G毫米波相控阵系统研究,为节约系统功率与成本开销,提升整体性能及可靠性,基于创新融合双频的功能复用芯片技术和毫米波集成电路中分布参数分析与设计理论,实现融合C波段与毫米波工作能力并具有新型拓扑架构的 CMOS 射频收发机及前端芯片。具有集成度高,可复用部分电路功能,灵活调配双频收发通道资源等优势特点。提升芯片整体性能及可靠性。主要记录了毫米波收发频率范围;射频通道数;接收机的噪声系数;发射机的发射功率(1dB压缩点)等观测值,数据量262MB。
This dataset focuses on C-band integrated millimeter-wave (mmWave) CMOS transceiver chips, which are developed for 5G mmWave phased array system research leveraging function reuse and frequency band fusion technologies. To cut system power and cost overhead, improve overall performance and reliability, the design adopts innovative dual-band integrated function reuse chip technology and distributed parameter analysis and design theory for mmWave integrated circuits, realizing CMOS RF transceivers and front-end chips with a novel topology architecture that supports both C-band and mmWave operating modes. These chips feature high integration, partial circuit function reusability, flexible resource allocation for dual-band transceiver channels, and enhanced overall performance and reliability. The dataset primarily records observed metrics including mmWave transceiver frequency range, number of RF channels, receiver noise figure, transmitter output power (1dB compression point), with a total data size of 262 MB.




