Supplementary material
收藏DataCite Commons2024-05-05 更新2024-08-18 收录
下载链接：
https://aip.figshare.com/articles/dataset/Supplementary_material/25602633
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资源简介：
Supplementary material for further details on the simulation method, cross-sectional TEM images, linear regression of the capacitance-area relationship, and comparison between the electrical characteristics of the Au(bottom)/DNTT/Al(top) and Al(bottom)/DNTT/Au(top) diodes
提供机构：
AIP Publishing
创建时间：
2024-04-15
